3D Glass Solutions Inc., an Albuquerque, NM-based innovator of glass-based three-dimensional integrated passive solutions for radio frequency (RF), photonic and datacenters, closed a $30m Series C financing.
The round was led by Walden Catalyst Ventures, with participation from existing investors, including Intel Capital and Lockheed Martin Ventures, as well as new investments from Applied Ventures, LLC, Cambium Capital, and Mesh Cooperative Ventures. Lip-Bu Tan, chair of Walden International and founding managing partner of Walden Catalyst Ventures, will join 3DGS’ Board of Directors.
The company intends to use the funds to increase its US based manufacturing capacity for high-volume production of 3D integrated passives and substrate products.
Led by Babu Mandava, President and CEO, 3DGS manufactures a wide variety of glass-based, system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® glass ceramic technology for applications in RF electronics and photonics used in automotive radar, IC electronics, medical, aerospace, defense, wireless infrastructure, mobile handset and IoT industries. 3DGS glass ceramic-based RF products can be combined with any number of designs or devices to create incredibly unique and valuable SiP products. The company has created foundational patent positions related to all photosensitive glass- ceramic materials and devices and owns the fundamental intellectual property for all four positions (materials, design, systems and manufacturing) related to glass-ceramic devices for the electronics packaging industry. 3DGS leverages its unique product solutions to provide device manufacturing and systems integration services for several standard and custom products.
FinSMEs
19/04/2023