Thintronics, Inc., a Berkeley, CA-based electronic materials startup, raised an undisclosed amount in Series A extension.
The round was led by Maverick Capital and Translink Capital with participation from M Ventures, the CVC arm of Merck KGaA, Darmstadt, Germany, TGVP, the US CVC arm of TOPPAN Holdings, and previous investor Tallwood Venture Capital.
The company intends to use the funds to expand operations and its development efforts.
Led by CEO Stefan Pastine, and CTO Tristan El Bouayadi, Thintronics is an electronic materials startup supplying high-performance insulators for emerging AI datacenter, networking, and RF/millimeter-wave (mmW) applications. The company’s insulators remain stable at high frequencies using a new generation of isotropic, skew-free, ultra-low loss, and low Dk dielectric materials. They can be applied as ultra-thin coatings directly onto chips and interconnects. The coatings act as an advanced insulation layer, minimizing signal loss and energy dissipation in high-speed data channels. Benefits include significant reductions in data center energy loss from electromagnetic radiation and heat dissipation. A further benefit results from Thintronics moving away from the need for fiber glass to provide structural rigidity for PCBs, allowing new levels of flexibility for high performance boards and semiconductors.
15/08/2024