GainSpan Corporation, a San Jose, CA-based ultra-low power embedded Wi-Fi semiconductor solutions company, has raised $18m in Series C funding.
Backers include Hatteras Funds, Mobile Internet Capital, and existing investors Opus Capital, In-Q-Tel, Intel Capital, New Venture Partners, Sigma Partners and Camp Ventures.
The company intends to use the new funds to further develop its next-generation ultra-low power Wi-Fi chip.
Led by President and CEO Greg Winner, GainSpan develops ultra-low power embedded Wi-Fi solutions focused on connecting Things to the Internet, and People to Things. With its system-on-chip (SoC), modules and software, the company enables customers to leverage the installed base of Wi-Fi access points and smartphones to create new connected embedded products for healthcare, smart energy and control and monitoring in industrial, commercial and residential markets.
GainSpan has R&D in India.
FinSMEs
05/12/2011